Noctua NT-H2 Thermal Compound - 3.5g

Noctuas NT-H2 is a professional TIM solution for enthusiasts who do not want to forego outstanding performance or maximum ease of use. A hybrid configuration of different micro-particles enables minimal thermal resistance, easy handling and excellent long-term stability.

Compared to its predecessor, the mixture of metal-oxide microparticles has been improved again. As a result, a lower overall thermal resistance and a lower layer thickness were achieved when the contact pressure was applied. A significantly higher performance has been achieved, especially with CPUs with a high TDP.

Like its predecessor, the NT-H2Thermally conductive paste has been specially optimized for use in the PC area and, thanks to its very good wetting and distribution properties, enables excellent results.

The paste spreads excellently under pressure and therefore does not have to be spread on the heatspreader. This not only reduces the paste consumption, but also the installation effort: A drop of NT-H2 in the middle of the CPU, put on the cooler – done! It quickly reaches its full capacity and does not require a longer burn-in time.

Of course, neither solvents nor other substances with a low boiling point are included and the thermal paste has excellent long-term stability. Thanks to the excellent curing, bleeding, dry-out and thermal cycling characteristics, the Noctua NT-H2 can also be used for several years without any problems.

Furthermore, it has an extremely low dielectric constant and a high dielectric strength. Thus, when used in the PC area, there is no risk of short circuits, even if there is direct contact with conductor tracks or components.

The NT-H2 is suitable for use with copper and aluminum coolers and is fully compatible with all materials commonly used in the PC sector.

Danger! Please note the manufacturers warnings before use!