Noctua NT-H1 SW Edition Thermal Compound - 3.5g

– Designed for a long service life
– For cooling processors, graphics cards or voltage converters
– High maximum operating temperature of up to 110 degreesC
– Easy installation possible without elapse
– Suitable for use with copper and aluminum coolers

Noctua supports your cooling solutionNoctuas NT-H1 SW Edition is a professional TIM solution for enthusiasts who do not want to sacrifice excellent performance or maximum ease of use. A hybrid configuration of different micro-particles enables minimal thermal resistance, easy handling and excellent long-term stability.

The NT-H1 SW Edition thermal compound has been specially optimized for use in the PC sector and has achieved excellent results thanks to its very good wetting and distribution properties.

The paste is excellently distributed under pressure and therefore does not have to be elapsed on the heat spreader. This not only reduces the paste consumption, but also the installation effort: A drop of NT-H1 in the middle of the CPU, put on the cooler – done! It quickly reaches its full capacity and does not require a longer burn-in time.

Reliable and durable
Of course, neither solvents nor other substances with a low boiling point are included and the thermal compound has excellent long-term stability. Thanks to the excellent curing, bleeding, dry-out and thermal cycling characteristics, the NT-H1 SW Edition can easily be used for several years.

Furthermore, it has an extremely low dielectric constant, as well as a high electrical dielectric strength. Thus, there is no risk of short circuits when used in the PC area, even with direct contact with conductor paths or components.

The NT-H1 SW Edition is suitable for use with copper and aluminum coolers and is fully compatible with all materials commonly used in the PC sector.