Thermal Grizzly Pad Minus 8-100 x 100 x 1.0 mm

To achieve these objectives, Thermal Grizzly has worked in product development closely with the famous Extreme overclockers novel der8auer Hartung and tested, developed chemical compositions and analyzed competitors. Now, the first product lines are completed, which are the most demanding requirements of the manufacturer and the overclocking community justice.

For applications where thermal grease does not come due to unwieldy plot in question, or where distances have to be bridged between the heat source and heat sink, the thermal Grizzly Minus pad 8 is the ideal choice – for example, memory chips and voltage transformers. It is based on a silicon-containing carrier complex and alumina as a heat transfer medium – as well as thermal compounds, and it is therefore also equivalent level of performance.

The minus pad 8 is available in three different sizes – available in four strengths and between 0.5 and 2 millimeters, the pads work great even at very low pressure and the thermal conductivity is only slightly affected by the strength – here 100 x 100 mm. The choice of the starch should only depend on bridging gap here also.