Thermal Grizzly Minus Pad Advance - 120 x 20 x 3.0 mm, 4 pieces

Powerful alternative to thermal paste
With the Thermal Grizzly Minus Pad Advance, the Hamburg-based cooling specialist is expanding its product range to include advanced thermal pads. Based on the predecessor Minus Pad 8, they have been further developed to significantly improve thermal conductivity.

The Minus Pad Advance is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heat sink needs to be bridged. It is therefore ideal for use with memory chips or voltage converters. It is based on a carrier complex containing silicone and aluminum oxide as a heat transfer medium and thus achieves a similar thermal conductivity to thermal paste.

The Minus Pad is available in various dimensions and thicknesses from 0.5 to 3 millimeters. Since it works optimally even with minimal contact pressure and the thermal conductivity is hardly affected by the thickness, the choice of thickness should only be tailored to the distance to be bridged.