ENZOTECH MOS-C1-LE heatsinks were designed to offer exceptional heat dissipation for integrated MOSFET motherboards and video cards. MOS-C1-LE heatsinks are made using a forged copper process which produces a dense material that is extremely efficient at heat extraction.
ENZOTECH MOS-C1-LE heatsinks were designed to offer exceptional heat dissipation for integrated MOSFET motherboards and video cards. MOS-C1-LE heatsinks are made using a forged copper process which produces a dense material that is extremely efficient at heat extraction.
ENZOTECH MOS-C1-LE heatsinks were designed to offer exceptional heat dissipation for integrated MOSFET motherboards and video cards. MOS-C1-LE heatsinks are made using a forged copper process which produces a dense material that is extremely efficient at heat extraction.
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The MOS-C1-LE heatsink is far superior to traditional heat sinks currently found on the market and it provides the best thermal conductivity available to dissipate heat from the MOSFET in your system.
ATI & NVIDIA Compatible
Pure forged copper
Easy installation by using 3M™ 8815 Thermal Tape
Multipack – Ten (10) piece set
Technical Details:
Dimensions (L x W x H): 10 x 10 x 14mm
Material: C1100 Forged Coppper
Finish: Matt Black
Weight: 4g (each)
Thermal Adhesive: 3M™ 8815 Thermal Tape
