AMD Ryzen 9 7950X3D 5.7 GHz (Raphael) AM5 - boxed

– AMD Ryzen 9
– 16 Zen 4 cores with only 120 W Thermal Design Power (TDP)
– 32 threads thanks to Simultaneous Multithreading (SMT)
– Very high single and multi-thread performance
– Base clock of 4.2 GHz & 5.7 GHz Turbo with Precision Boost 2
– Fast PCI Express 5.0 interface
– Large L3 cache: 32MB + 96MB 3D V-Cache
– Compatible with AMD AM5 processor socket
– Natively supports DDR5 RAM with max. 5,200 MHz (dual channel)
– Without CPU cooler!
– The AMD Ryzen 9 7950X3D 16-core CPU with 5.7 GHz Precision Boost 2

AMD Ryzen 9 7950X Box
The AMD Ryzen 9 7950X3D from the Raphael processor family has 16 CPU cores based on the Zen 4 architecture. After Zen 3, this is the fifth generation of the Zen microarchitecture. Compared to the previous generation, each processor core now has access to the entire L3 cache. This made it possible to significantly increase performance in games. In addition, the Ryzen 7000 processors offer significantly increased per-clock performance and a higher boost clock.

Paired with an AMD X670(E) or B650(E) chipset, the AMD Ryzen 9 7950X3D supports the PCI Express 5.0 standard, which is twice as fast as PCIe 4.0. All Ryzen 7000 processors use the AM5 platform and were developed for use with corresponding AMD chipsets. The prerequisite is an update to the current BIOS version.

AMD Ryzen 9 7950X3D Box
The AMD Ryzen 9 7950X3D has 16 physical CPU cores, each of which can process two threads at the same time thanks to Simultaneous Multithreading (SMT), effectively doubling the number of computing cores to 32 with the additional 16 virtual cores. The 16-core processor works with a high base clock of 4.2 GHz per core, which adapts precisely to the respective application scenario in real time using Precision Boost 2 and within the scope of the Thermal Design Power (TDP) from 120 watts up to 5.7GHz Turbo increased.

The silicon of the CPU cores is lithographed using the advanced 5nm FinFET manufacturing process with stacked transistors (also called 3D transistors) using Extreme Ultraviolet (EUV) technology. The space on the processor die gained through the greatly reduced structure sizes enables the integration of more cache memory.

The I/O chiplet in the CPU package responsible for the data lines is produced using 6-nanometer FinFET production and provides 24 PCIe lanes, four of which are used to connect to the mainboard chipset and to connect NVMe devices. SSDs are reserved. This leaves 16 lanes for communication with graphics cards, while additional PCIe lanes are provided for additional data carriers, expansion cards and peripheral devices depending on the motherboard chipset.

PCI-Express 5.0 with AMD X670 or B650 chipset
AMD Ryzen 9 Box
In combination with an AMD X670/E or B650/E chipset, the AMD Ryzen 9 7950X3D supports the PCI Express standard version 5.0. PCIe 5.0 is backwards compatible and can be used with all expansion cards of previous generations. A data transfer rate that is twice as high as PCIe 4.0 is possible per PCIe 5.0 lane, meaning that an NVMe SSD connected via four PCIe 5.0 lanes can achieve a theoretical read/write speed of up to 15.75 GB/s.

The CPUs integrated memory controller supports fast and energy-efficient DDR5 memory in dual-channel mode with or without ECC error correction at a native clock frequency of 5,200 MHz, although significantly higher clock rates are possible through overclocking.

Technical details:
Type:
– AMD Ryzen 9 7950X3D
– Zen 4 / Raphael
– Manufacturing: 5 nm FinFET (CPU), 6 nm LP (I/O chiplet)
– CPU cores: 16 / 32 (physical / virtual)
– CPU clock:
– Base clock: 4.2 GHz
– Boost clock: max. 5.7 GHz (Precision Boost 2)
– Level 1 cache: 768 KB
– Level 2 cache: 12 MB
– Level 3 cache: 128 MB
– Chipset interface: PCI-Express 5.0 (only with AMD X670(E) or B650(E) chipset)
– Integrated PCI Express lanes: x28 (x16 for GPU + x8 for SSD + x4 for chipset)
– Integrated graphics unit:
– AMD Radeon Graphics (2 cores, 400/2,200 MHz base/boost clock)
– Random access memory:
– Storage controller: internal
– Memory channels: 2
– Memory standard: DDR5 (ECC & non-ECC)
– native memory clock: 5,200 MHz (without OC)
– TDP: 120 watts
– Socket Compatibility: AM5
– Features & instruction set extensions:
– PCI-Express 5.0 (only with AMD X670(E) or B650(E) chipset)
– Precision Boost 2
– SMT (Simultaneous Multithreading)
– X86-64 (64-bit processor AMD64)
– AMD-V (Compute Virtualization)
– VT-Vi (I/O MMU virtualization)
– 2x AES units (encryption)
– AVX & AVX2 (Advanced Vector Extensions)
– NX-Bit (virus protection) & EVP (extended virus protection)
– Turbo Core 3.0
– without CPU cooler