Thermal Grizzly Minus Pad Extreme - 120 × 20 × 1.5mm [TG-MPE-120-20-15-R]

This is particularly useful when distances between the heat source and the heat sink have to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay.

This enables an ideal surface design with maximum possible compaction. Thermal conductivity has been improved by approximately 260% over the Minus Pad 8, allowing for the best performance for difficult cooling tasks such as voltage regulators and memory ICs.

The Minus Pad Extreme is available in different sizes and thicknesses - here 120 x 20 x 1.5 mm. The pads work extremely well with very little contact pressure and the thermal conductivity is only slightly affected by the thickness. The choice of thickness should therefore depend entirely on the gap to be bridged. The Minus Pad Extreme is electrically isolating. Due to consistency, single use only is recommended.

Danger! This product comes with a protective film that must be removed prior to installation. We assume no liability for damage caused by faulty or incorrect assembly and improper use!

Technical details:
- Dimensions: 120 x 20 x 1.5mm
- amount: 1
- Density: 3.38 g/cm³
- Hardness: 65 Shore 00
- Dielectric Strength: 8KV/mm ASTM D149
 -Operating temperature: -100 to +250 °C
- Flammability: V-0
- Colour: rusty brown