Thermal Grizzly Minus Pad 8 - 120 × 20 × 3,0 mm [TG-MP8-120-20-30-1R]

The goal is to supply the overclocker scene with high-performance thermal conduction products, which are still a weak point - but the product portfolio can also be used for better and quieter cooling of gaming computers, workstations, mini PCs and many other purposes. In addition to higher clock rates, better thermal conduction products enable quieter cooling and a longer service life for the components to be cooled.

In order to achieve these goals, Thermal Grizzly worked closely with the well-known extreme overclocker Roman "der8auer" Hartung during product development and tested them, developed chemical compositions and analyzed competitors. Now the first product lines have been completed, which also meet the highest demands of the manufacturer and the overclocking community.

The Thermal Grizzly Minus Pad 8 is the ideal choice for applications where thermal paste is not an option due to the unwieldy application or where distances have to be bridged between the heat source and the heat sink - for example on memory chips and voltage converters. It is based on a silicon-containing carrier complex and aluminum oxide as the heat transfer medium - just like thermal paste, and it is therefore also similarly efficient.

The Minus Pad 8 is available in three different dimensions - here 120 x 20 mm - and in five thicknesses between 0.5 and 3 millimeters, whereby the pads work excellently even with very little contact pressure and the thermal conductivity is only slightly influenced by the thickness. The choice of strength should therefore only depend on the gap to be bridged.

Danger! Please note the manufacturer's warnings before use!

Technical details:
- Dimensions 120 x 20 x 3mm
- amount: 1
- Thermal conductivity: 8 W/(m K)
- Operating temperature: -100 to +200 °C
- Color beige