BitsPower Summit LGA 3647 - Acetal [BP-CPUNLGA3647-POM]

- Designed for Intel processors with socket LGA 3647
- Very high fin density for exceptional cooling
- Copper cooling surface for optimal heat dissipation
- Simple and powerful

The Bitspower Summit LGA 3647 has been specially developed with the extreme heat generation of Xeon CPUs with the socket LGA 3647 Narrow. Through an open design with large chambers inside the CPU block, it is able to more than cover the thermal needs of modern CPUs.

Inside there are many small copper fins. As a result, the cooling surface is particularly large and the heat dissipation is very fast. Further support is provided by a particularly flow-friendly design, with which warm liquid is quickly removed. This excludes the mixing of hot and cold and favors the cooling performance.

The surface of the Summit LGA 3647 has been attractively designed with a simple design. Two G1/4-inch connectors make it easy to integrate into your loop. Due to the small size of the block, it does not interfere with the operation of workers with larger heat sinks.

Technical details
- Color: Black
- Dimensions: 108 x 79.8 x 19.5mm (L x W x H)
- Material cooling surface: Copper
- Connections: 2x G1/4 inch
Compatible:
- Intel LGA 3647 Narrow
Scope of supply:
- 1x Bitspower Summit LGA 3647 - Acetal
- 1x screw set and fastening material